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When setting up the assembly of a new printed circuit board the application of solder paste or adhesive comes first. Irrespective of whether a printing or dispensing process is used the alignment and/or accuracies of coordinates and deposit sizes need to be verified. To avoid having to clean a production board before it can be used in earnest the Trial Print Foil is applied first, solder paste/adhesive applied next, accuracy checked optically, solder paste/adhesive wiped off and the process repeated until satisfied and finally the foil removed without leaving any residue on the board, which is then ready for production. The DIN A4 sheets can be cut to size and provide a clear view of the board below.
- for trial prints of solder paste unto PCBs
- useful when setting up a pick and place machine for the population of a new printed circuit board
- without contaminating boards that would otherwise have to be cleaned thoroughly before use in production
Highlights
- single sided adhesive DIN A4 sheet
- residue-free removal in one piece
- light adherent, transparent, printable foil
Description
When setting up the assembly of a new printed circuit board the application of solder paste or adhesive comes first. Irrespective of whether a printing or dispensing process is used the alignment and/or accuracies of coordinates and deposit sizes need to be verified. To avoid having to clean a production board before it can be used in earnest the Trial Print Foil is applied first, solder paste/adhesive applied next, accuracy checked optically, solder paste/adhesive wiped off and the process repeated until satisfied and finally the foil removed without leaving any residue on the board, which is then ready for production. The DIN A4 sheets can be cut to size and provide a clear view of the board below.
Conclusion
A useful product that avoids wasting valuable printed circuit boards or having to clean them.
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